Cleanroom Capabilities

Vacuum deposition:

  • Sputtering with in-situ ion-milling. Dedicated chambers to superconductors, magnetic materials, and dielectrics

  • Ebeam evaporation dedicated to metals (lift-off and conformal deposition) and dielectrics. In-situ ion-milling available

  • ALD dedicated to metals and high-K dielectrics

  • Thermal evaporation

  • PECVD

  • ICP-PECVD

  • MVD

Etching:

  • ICP, RIE, IBE

  • Fluorine etcher

  • Atomic layer etching (ALE)

  • Deep Si etcher

  • Plasma cleaning and activation

  • Asher

  • Focused ion beam lithography

Lithography:

  • MLA laser writer (500 nm resolution)

  • Stepper and ASML lithography (500 and 200 nm resolution)

  • Ebeam lithography (Raith)

  • Focused ion beam lithography (Raith)

  • Mask aligner (MJB-3 and SUSS MA-6)

Wet processing:

  • Solvent

  • Developing

  • Plating

  • Corrosive

  • HF

  • Polishers

Thermal processing:

  • Various furnaces, ovens, and RTAs

Packaging:

  • Automated dicing

  • Automated cleaver

  • Flip-chip bonder

  • Wafer bonder

  • Wafer/wax bonder

  • Wire bonder

  • PCB

  • Soldering

Material characterization:

  • SEM/EDAX

  • FIB/STEM

  • AFM

  • XRD

  • Profilometers

  • Ellipsometer

  • Optical film thickness & wafer mapping

  • DUV optical microscope

  • Laser scanning confocal microscope

  • Film stress

  • Particle count

Device Characterization Capabilities

Electrical characterization:

  • Probe station

  • CV and IV measurements

  • High frequency measurements

  • Cryogenic (PPMS 1.8-400 K) electrical low noise, heat capacity, and magnetotransport/Hall measurements

Optical characterization:

  • Pulsed Pump-probe spectrocopy

  • EQE measurements

  • PL measurements